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| HAT2028R/HAT2028RJ Silicon N Channel Power MOS FET High Speed Power Switching ADE-208-524C (Z) 4th. Edition February 1999 Features * * * * For Automotive Application ( at Type Code "J ") Low on-resistance Capable of 4 V gate drive High density mounting Outline SOP-8 8 5 76 3 12 78 DD 56 DD 4 2 G 4 G S1 S3 1, 3 Source 2, 4 Gate 5, 6, 7, 8 Drain MOS1 MOS2 HAT2028R/HAT2028RJ Absolute Maximum Ratings (Ta = 25C) Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body-drain diode reverse drain current Avalanche current HAT2028R HAT2028RJ Avalanche energy HAT2028R HAT2028RJ Channel dissipation Channel dissipation Channel temperature Storage temperature Note: 1. 2. 3. 4. Pch Pch Tch Tstg Note2 Note3 Symbol VDSS VGSS ID I D(pulse) I DR I AP Note4 Note1 Ratings 60 20 4 32 4 -- 4 Unit V V A A A -- A -- mJ W W C C EAR Note4 -- 1.37 2 3 150 - 55 to + 150 PW 10s, duty cycle 1 % 1 Drive operation : When using the glass epoxy board (FR4 40 x 40 x 1.6 mm), PW 10s 2 Drive operation : When using the glass epoxy board (FR4 40 x 40 x 1.6 mm), PW 10s Value at Tch=25C, Rg50 2 HAT2028R/HAT2028RJ Electrical Characteristics (Ta = 25C) Item Drain to source breakdownvoltage Gate to source breakdownvoltage Gate to source leak current Zero gate voltage drain current Zero gate voltage drain current HAT2028R Symbol V(BR)DSS V(BR)GSS I GSS I DSS Min 60 20 -- -- -- -- -- 1.3 -- -- 3.3 -- -- -- -- -- -- -- -- -- Typ -- -- -- -- -- -- -- -- 0.08 0.12 5 280 150 55 15 100 35 45 0.88 40 Max -- -- 10 1 0.1 -- 10 2.3 0.1 0.16 -- -- -- -- -- -- -- -- 1.15 -- Unit V V A A A A A V S pF pF pF ns ns ns ns V ns IF = 4 A, VGS = 0 Note5 IF = 4 A, VGS = 0 diF/ dt = 50 A/s VDS = 48 V, VGS = 0 Ta = 125C VDS = 10 V, I D = 1 mA I D = 2 A, VGS = 10 V Note5 I D = 2 A, VGS = 4 V Note5 I D = 2 A, VDS = 10 V Note5 VDS = 10 V VGS = 0 f = 1MHz VGS = 4 V, ID = 2 A VDD 30 V Test Conditions I D = 10 mA, VGS = 0 I G = 100 A, VDS = 0 VGS = 16 V, VDS = 0 VDS = 60 V, VGS = 0 HAT2028RJ I DSS HAT2028R I DSS HAT2028RJ I DSS VGS(off) RDS(on) RDS(on) Gate to source cutoff voltage Static drain to source on state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body-drain diode forwardvoltage Body-drain diode reverse recovery time Note: 5. Pulse test |yfs| Ciss Coss Crss t d(on) tr t d(off) tf VDF t rr 3 HAT2028R/HAT2028RJ Main Characteristics Power vs. Temperature Derating 4.0 Pch (W) I D (A) 100 30 10 3 Maximum Safe Operation Area 10 s 10 0 s Test Condition : When using the glass epoxy board (FR4 40x40x1.6 mm), PW < 10 s 3.0 Channel Dissipation Drain Current DC PW 1m = s 2.0 1 1 0.3 0.1 Op 10 er ati ms 1.0 Dr ive 2 ive Dr Op er at ion at ion er Op Operation in this area is limited by R DS(on) on (P W N < ote 10 6 s) 0 50 100 150 Ta (C) 200 Ambient Temperature Ta = 25C 0.03 1 shot Pulse 1 Drive Operation 0.01 0.1 0.3 1 3 10 30 100 Drain to Source Voltage V DS (V) Note 6 : When using the glass epoxy board (FR4 40x40x1.6 mm) 20 Typical Output Characteristics 10V 8 V 6V 5V 4.5 V 4V 3.5 V 3V Pulse Test VGS = 2.5 V (A) Typical Transfer Characteristics 20 -25C Tc = 75C 12 25C I D (A) 16 16 12 Drain Current 8 Drain Current ID 8 4 4 V DS = 10 V Pulse Test 0 0 2 4 6 Drain to Source Voltage 8 V DS (V) 10 2 4 6 Gate to Source Voltage 10 8 V GS (V) 4 HAT2028R/HAT2028RJ Drain to Source Saturation Voltage vs. Gate to Source Voltage Static Drain to Source on State Resistance vs. Drain Current 1 Pulse Test 0.5 0.2 VGS = 4 V 0.1 10 V Pulse Test 0.4 0.3 0.2 ID=2A 1A 0.5 A 0.1 0 Drain to Source On State Resistance R DS(on) ( ) 0.5 Drain to Source Saturation Voltage V DS(on) (V) 0.05 0.02 0.01 0.1 2 4 6 Gate to Source Voltage 8 V GS (V) 10 0.2 0.5 1 Drain Current 2 5 I D (A) 10 Static Drain to Source on State Resistance R DS(on) ( ) Forward Transfer Admittance |y fs | (S) Static Drain to Source on State Resistance vs. Temperature 0.25 Pulse Test 0.20 I D = 0.5, 1, 2 A Forward Transfer Admittance vs. Drain Current 20 10 5 25 C Tc = -25 C 0.15 VGS = 4 V 0.5, 1, 2 A 10 V 2 1 0.5 0.2 0.2 75 C 0.10 0.05 0 -40 V DS = 10 V Pulse Test 1 0.5 2 5 10 Drain Current I D (A) 20 0 40 80 120 160 Case Temperature Tc (C) 5 HAT2028R/HAT2028RJ Body-Drain Diode Reverse Recovery Time 1000 500 Capacitance C (pF) 500 Reverse Recovery Time trr (ns) Typical Capacitance vs. Drain to Source Voltage VGS = 0 f = 1 MHz Ciss 200 100 50 Crss 20 10 0 10 20 30 40 50 Drain to Source Voltage V DS (V) Coss 200 100 50 20 10 di/dt = 50 A/s V GS = 0, Ta = 25C 5 0.1 0.2 0.5 1 2 5 10 Reverse Drain Current I DR (A) Dynamic Input Characteristics V DS (V) V GS (V) 100 I D= 4 A 20 1000 300 100 30 10 3 Switching Characteristics Switching Time t (ns) 80 16 V DD = 10 V 25 V 50 V V GS V DD = 50 V 25 V 10 V tr tf t d(off) t d(on) V GS = 4 V, V DD = 30 V PW = 3 s, duty < 1 % 0.5 1 2 5 Drain Current I D (A) 10 Drain to Source Voltage 60 V DS 12 40 8 20 4 0 10 Gate to Source Voltage 0 2 4 6 8 Gate Charge Qg (nc) 1 0.1 0.2 6 HAT2028R/HAT2028RJ Reverse Drain Current vs. Souece to Drain Voltage Repetive Avalanche Energy E AR (mJ) Maximun Avalanche Energy vs. Channel Temperature Derating 2.5 I AP = 4 A V DD = 25 V L = 100 H duty < 0.1 % Rg > 50 20 Reverse Drain Current I DR (A) 16 V GS = 5 V 12 0, -5 V 2.0 1.5 8 1.0 4 Pulse Test 0 0.4 0.8 1.2 1.6 2.0 Source to Drain Voltage V SD (V) 0.5 0 25 50 75 100 125 150 Channel Temperature Tch (C) Avalanche Test Circuit EAR = Avalanche Waveform 1 2 * L * I AP * 2 VDSS VDSS - V DD V DS Monitor L I AP Monitor V (BR)DSS I AP VDD ID V DS Rg Vin 15 V D. U. T 50 0 VDD Switching Time Test Circuit Vin Monitor D.U.T. RL Vin Vin 4V 50 V DD = 30 V Vout Monitor Switching Time Waveform 90% 10% 10% 90% td(on) tr 90% td(off) tf 10% Vout 7 HAT2028R/HAT2028RJ Normalized Transient Thermal Impedance vs. Pulse Width (1 Drive Operation) 10 Normalized Transient Thermal Impedance s (t) 1 D=1 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01 t ho pu lse ch - f(t) = s (t) * ch - f ch - f = 125 C/W, Ta = 25 C When using the glass epoxy board (FR4 40x40x1.6 mm) PDM PW T 0.001 1s D= PW T 0.0001 10 100 1m 10 m 100 m 1 10 100 1000 10000 Pulse Width PW (S) 10 Normalized Transient Thermal Impedance s (t) Normalized Transient Thermal Impedance vs. Pulse Width (2 Drive Operation) 1 D=1 0.5 0.2 0.1 0.1 0.05 0.02 0.01 e uls tp ho 1s 0.01 ch - f(t) = s (t) * ch - f ch - f = 166 C/W, Ta = 25 C When using the glass epoxy board (FR4 40x40x1.6 mm) PDM PW T 0.001 D= PW T 0.0001 10 100 1m 10 m 100 m 1 10 100 1000 10000 Pulse Width PW (S) 8 HAT2028R/HAT2028RJ Package Dimensions Unit: mm 5.0 Max 8 5 1 4 4.0 Max 1.75 Max 6.2 Max 0.25 Max 0 - 8 1.27 0.51 Max 0.25 Max 1.27 Max 0.15 0.25 M Hitachi code EIAJ JEDEC FP-8DA -- MS-012AA 9 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan. |
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